30.05.2012 smt750 -23 1 of 3 sm t750 - 23 technical data infrared led , smd al ga as sm t750 - 23 is a alga as led, mounted on a lead frame as top led package with epoxy resin lens. on forward bias, it emits a radiation of typical 20 mw at a peak wavelength of 75 0 nm . specifications (unit : mm) ? structure: alga as ? peak wavelength: 750 nm ? optical output power: 20 m w ? package: smd, ppa resin lead frame die: silver plated ? lens: epoxy resin (?2.6 mm) absolute maximum ratings (t a =25c) item symbol value unit power dissipation p d 19 0 mw forward current i f 10 0 ma pulse forward current * 1 i fp 5 00 ma reverse voltage v r 5 v operating temperature t opr - 2 0 ? +80 c storage temperature t stg - 30 ? +8 0 c soldering temperature * 2 t sol 2 55 c * 1 duty = 1%, pulse width = 1 0 s * 2 m ust be completed within 3 seconds at 2 6 0c electro - optical characteristics item symbol condition min. typ. max. unit forward voltage v f i f = 50 ma - 1.85 2.00 v reverse current i r v r = 5 v - - 10 a total radiated power p o i f = 50 ma 12 2 0 - mw r adiant intensity i e i f = 50 ma 15 35 - mw/sr peak wavelength p i f = 50 ma 735 75 0 765 nm half width ? i f = 50 ma - 3 5 - nm viewing half angle 1/2 i f = 50 ma - 15 - deg. rise time t r i f = 50 ma - 8 0 - ns fall time t f i f = 50 ma - 8 0 - ns radiate d power is measured by photodyne #500 radiant intensity is measured by tektronix j -6512 note: the above specifications are for reference purpose only and subjected to change without prior notice.
30.05.2012 smt750 -23 2 of 3 typical performance curves relative spectral emission radiation characteristics
30.05.2012 smt750 -23 3 of 3 precaution for use 1. cautions ? do not look directly into the emitting area of the led during operation! ? warning: led is emitting invisible light! 2. soldering conditions ? do not apply any stress to the lead particularly when heat. ? after soldering the leds should be protected from mechanical shock or vibration until th e leds return to room temperature. ? when it is necessary to clamp the leds to prevent soldering failure, it is important to minimize the mechanical stress on the leds. recommended land layout soldering conditions (unit: mm) 3. static electricity ? the l eds are very sensitive to static electricity and surge voltage. so it is recommended that a wrist band and/or an anti - electrostatic glove be used when handling the leds. ? all devices, equipment and machinery must be grounded properly. it is recommended that precautions should be taken against surge voltage to the equipment that mounts the leds. 4. heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when making the system design. the coeff icient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within t he maximum ratings given in the specification. ? the operating current should be decided after considering the ambient maximum temperature of leds. 5. storage ? the leds should be stored at 30c or less and 60%rh or less after being shipped and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with nitrogen atmosphere and moisture absorbent material at less than 30%rh. ? please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.
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